this is information on a product in full production. december 2013 docid024459 rev 1 1/7 7 EMIF03-SIM06F3 3-line ipad?, emi filter including esd protection datasheet ? production data features ? emi symmetrical (i/o) low-pass filter ? high efficiency in esd protection ? lead-free package ? very thin package ? high reliability offered by monolithic integration ? high reduction of parasitic elements through integration and wafer level packaging complies with the following standards: ? iec 61000-4-2 level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) ? iec 61000-4-2 level 1 ? 2 kv (air discharge) ? 2 kv (contact discharge) application where emi filtering in esd sensitive equipment is required: ? mobile phones and communication systems ? computers, printers and mcu boards description the EMIF03-SIM06F3 chip is a highly integrated audio filter device designed to suppress emi/rfi noise in all systems subjected to electromagnetic interface. the filter included esd protection circuitry, which prevents damage to the protected device when subjected to esd surges up to 15 kv. figure 1. pin configuration (bump side) figure 2. functional schematic flip-chip package (11 bumps) 1 2 3 a b c d a2 and c2 bumps must be conneced together on the pcb a1 a2 r4 r1 r2 r3 10000 100 100 d1 d2 d3 b1 c1 c2 gnd gnd a3 b3 c3 www.st.com
characteristics EMIF03-SIM06F3 2/7 docid024459 rev 1 1 characteristics figure 3. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp internal pins (a1, b1, c1): esd discharge iec 61000-4-2 (1) , level 1 air discharge contact discharge external pins (a3, b3, c3, d1, d2, d3): esd discharge iec 61000-4-2 (1) , level 4 air discharge contact discharge 1. measurements done on iec 61000-4-2 test benc h. for further details see application note an3353, ?iec 61000-4-2 standard testing?. 2 2 20 20 kv t op operating temperature range - 40 to + 85 t stg storage temperature range - 55 to 150 table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit i rm v rm = 3 v 50 na v br i r = 1 ma 6 v r1 , r3 tolerance 20% 100 ? r2 tolerance 20% 47 r4 tolerance 20% 10 k ? c line v line = 0 v, v osc = 30 mv, f = 10 mhz (measured under zero light conditions) 81012pf symbol p arameter v = breakdown voltage i = leakage current @ v v = stand-off voltage v = clamping voltage i c line r i/o = = p = line capacitance eak pulse current br rm rm rm cl pp v cl pp series resistance between input and ouptput
docid024459 rev 1 3/7 EMIF03-SIM06F3 characteristics figure 8. line capacitance versus applied voltage figure 4. attenuation versus frequency figure 5. analog crosstalk versus frequency s21(db) 1m 3m 10m 30m 100m 300m 1g 3g -40 -35 -30 -25 -20 -15 -10 -5 0 data clk rst f(hz) xtalk (db) 1m 3m 10m 30m 100m 300m 1g 3g -70 -60 -50 -40 -30 -20 -10 0 data-d1 data-clk data-rst rst-d2 rst-d3 f(hz) figure 6. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 7. esd response to iec 61000-4-2 (-8 kv contact discharge) 22.6 v 14.0 v 11.1 v 6.8 v 1 2 4 3 10.0 v / div v : peak clamping voltage cl v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 20 ns / div 20.0 v / div -21.1 v -10.5 v -9.9 v -6.8 v 1 2 4 3 20 ns / div v : peak clamping voltage cl v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 0 2 4 6 8 10 12 14 16 02468 bias (v) d2 gnd c(pf)
package information EMIF03-SIM06F3 4/7 docid024459 rev 1 2 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com. ecopack ? is an st trademark. figure 9. flip-chip package dimensions figure 10. footprint recommendations figure 11. marking 1140 30 m 400 30 m 400 30 m 1540 30 m 170 m 170 m 255 40 m 500 m 50 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y x w z w dot, st logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) ecopack ? grade
docid024459 rev 1 5/7 EMIF03-SIM06F3 package information figure 12. tape and reel specification note: more information is availa ble in the application notes: an2348, ?ipad? 400 m flip chip: packag e description and recommendations for use? an1751, ?emi filters: recomm endations and measurements? 8.0 4.0 1.75 3.5 1.28 dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 2.0 ? 1.50 0.59 0.20 1.65
ordering informati on EMIF03-SIM06F3 6/7 docid024459 rev 1 3 ordering information figure 13. ordering information scheme 4 revision history table 3.ordering information order code marking package weight base qty delivery mode EMIF03-SIM06F3 kp flip chip 2.3 mg 5000 tape and reel (7?) emif 03 - sim 06 f3 emi filter number of lines information 3 letters = application 2 digits = version package f = flip chip x = 3: lead-free pitch = 400 m, bump = 255 m table 4.document revision history date revision changes 19-dec-2013 1 initial release
docid024459 rev 1 7/7 EMIF03-SIM06F3 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems wi th product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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